Imaging Structure with Embedded Light Sources

ABSTRACT

In embodiments of an imaging structure with embedded light sources, an imaging structure includes a silicon backplane with a driver pad array. The embedded light sources are formed on the driver pad array in an emitter material layer, and the embedded light sources can be individually controlled at the driver pad array to generate and emit light. A conductive material layer over the embedded light sources forms a p-n junction between the emitter material layer and the conductive material layer. Micro lens optics can be positioned over the conductive material layer to direct the light that is emitted from the embedded light sources. Further, the micro lens optics may be implemented as parabolic optics to concentrate the light that is emitted from the embedded light sources.

RELATED APPLICATION

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 13/397,516 filed Feb. 15, 2012 entitled “ImagingStructure with Embedded Light Sources”, the disclosure of which isincorporated by reference herein in its entirety.

BACKGROUND

Virtual reality can be viewed as a computer-generated simulatedenvironment in which a user has an apparent physical presence. A virtualreality experience can be generated in 3D and viewed with a head-mounteddisplay (HMD), such as glasses or other wearable display device that hasnear-eye display panels as lenses to display a virtual realityenvironment, which replaces the actual environment. Augmented reality,however, provides that a user can still see through the display lensesof the glasses or other wearable display device to view the surroundingenvironment, yet also see images of virtual objects that are generatedfor display and appear as a part of the environment. Augmented realitycan include any type of input such as audio and haptic inputs, as wellas virtual images, graphics, and video that enhances or augments theenvironment that a user experiences. As an emerging technology, thereare many challenges and design constraints with augmented reality, fromgeneration of the virtual objects and images so that they appearrealistic in a real environment, to developing the optics small andprecise enough for implementation with a wearable display device. Thereare also challenges to developing illumination sources forimplementation as micro projectors and/or imaging units for wearabledisplay devices.

Conventional LCOS (liquid crystal on silicon) projection technologiesuse an LED (light emitting diode) or laser source to generate light thatis reflected off of a silicon transistor array covered by an LCD (liquidcrystal display) material to either reflect and/or change thepolarization of the light. The LCOS reflective technology uses liquidcrystals instead of individual DLP (digital light processing) mirrors.The liquid crystals are applied to a reflective mirror substrate and, asthe liquid crystals open and close, the light is either reflected fromthe mirror below or blocked to modulate the emitted light. LCOS-basedprojectors typically use three LCOS chips, one each to modulate the red,green, and blue (RGB) components of the light. Similar to an LCDprojector which uses three LCD panels, both LCOS and LCD projectorssimultaneously project the red, green, and blue components of the light,such as for display on a display screen. A conventional displaytechnology utilizes OLEDs (organic light emitting diodes) that generatelight when current is applied through layers of the organic material.Although OLED cells can be individually controlled for illumination,unlike the LCOS material, the OLEDs are not viable for projectionillumination because they do not emit enough light.

Some conventional LED array scanning systems for display technologiesthat have large optical systems are typically too large and complex tobe implemented in imaging units for wearable display devices.Limitations of the current technology include the ability to modulateemitters in sequence in a scanning system, which can result in a slowrefresh rate, a blurred image quality, and/or limited color depth.Another limitation of conventional LED array scanning systems is therelatively larger pitch between the LED emitters, which results in alarger optical system with size and weight barriers to implementation ina consumer HMD product. The light that is emitted for LED array scanningis moved across a surface, such as via a MEMS (micro-electro-mechanicalsystems) mirror, LC scanner, or by moving optics. However, the lightefficiency of each emitter can vary based on production and materialvariances, bonding issues, connectivity issues, driver variance,micro-optics, color conversion variance, temperature, and/or opticdifferences across the surface.

SUMMARY

This Summary introduces simplified concepts of an imaging structure withembedded light sources, and the concepts are further described below inthe Detailed Description and/or shown in the Figures. This Summaryshould not be considered to describe essential features of the claimedsubject matter, nor used to determine or limit the scope of the claimedsubject matter.

An imaging structure with embedded light sources is described. Inembodiments, an imaging structure includes a silicon backplane with adriver pad array. The embedded light sources are formed on the driverpad array in an emitter material layer, and the embedded light sourcescan be individually controlled at the driver pad array to generate andemit light. A conductive material layer over the embedded light sourcesforms a p-n junction between the emitter material layer and theconductive material layer. Micro lens optics can be positioned over theconductive material layer to direct the light that is emitted from theembedded light sources. Further, the micro lens optics may beimplemented as parabolic optics to concentrate the light that is emittedfrom the embedded light sources.

In other embodiments, the embedded light sources are formed in inorganicmaterial as LEDs or lasers for direct light emission. The LEDs can beformed as individual emitters formed in the emitter material layer toapproximate parabolic reflection that directs reflected light fromwithin the inorganic material. The individual emitters are formed in theemitter material layer for individual current-based control at thedriver pad array. The emitter material layer can include a reflectivestructure to reflect the light to exit the individual emitter cells. Theembedded light sources include red, green, and blue (RGB) directemitters that form the imaging structure as a one-dimensional array ortwo-dimensional array of the embedded light sources. The imagingstructure may also be designed as a fault-tolerant array of sections ofthe embedded light sources, where a section includes redundant embeddedlight sources that can be controlled for increased illumination in anevent that one of the redundant embedded light sources fails.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of an imaging structure with embedded light sources aredescribed with reference to the following Figures. The same numbers maybe used throughout to reference like features and components that areshown in the Figures:

FIG. 1 illustrates examples of imaging structures with embedded lightsources in accordance with one or more embodiments.

FIG. 2 illustrates examples of the imaging structures implemented with amicro lens optic in accordance with one or more embodiments.

FIG. 3 illustrates an example system in which embodiments of an imagingstructure with embedded light sources can be implemented.

FIG. 4 illustrates an example system that includes an example of awearable display device in which embodiments of an imaging structurewith embedded light sources can be implemented.

FIG. 5 illustrates example method(s) of an imaging structure withembedded light sources in accordance with one or more embodiments.

FIG. 6 illustrates various components of an example device that canimplement embodiments of an imaging structure with embedded lightsources.

DETAILED DESCRIPTION

Embodiments of an imaging structure with embedded light sources aredescribed. An imaging structure can be formed in inorganic material andimplemented for individual cell control (e.g., individual pixelcontrol), where each cell is a direct emitter designed to emit a brightoutput of light that can be used for a number of optical solutions, suchas with light guides, free form optics, and/or direct projection. Forexample, light that is emitted from the embedded light sources (e.g.,RGB iLEDs or lasers) can be reflected through a micro lens optic andthen directed in an imaging system of a wearable display device (e.g.,glasses or a head-mounted display), such as reflected off of a MEMSmirror and then directed into a waveguide or otherwise projected.

In embodiments, implementations of the imaging structure emits lightthat can be utilized for waveguide, projection, and/or free form opticssolutions. In embodiments, an imaging structure with embedded lightsources provides several benefits over conventional techniques, such asreduced power consumption, which may be as little as one-sixth ofconventional solutions due in part to independent pixel control. Otherbenefits include the smaller size of the imaging structure because theimager and light source are implemented as one structure, and improvedquality of image due to a strong reduction of stray light, such as maybe seen with traditional LCOS solutions.

While features and concepts of an imaging structure with embedded lightsources can be implemented in any number of different devices, systems,environments, and/or configurations, embodiments of an imaging structurewith embedded light sources are described in the context of thefollowing example devices, systems, and methods.

FIG. 1 illustrates examples 100 of an imaging structure with embeddedlight sources in accordance with one or more embodiments. An imagingstructure 102, similar to a transistor array, has material layers thatform the embedded light sources 104 of the imaging structure to directlyemit light. For example, inorganic LED (iLED) material can be utilizedthat produces greater luminescence than typical OLED micro-displaysolutions which are principally limited to low light scenarios. In thisexample, the imaging structure 102 is constructed with a siliconbackplane layer 106, a driver pad array 108, an emitter material layer110, and a conductive material layer 112 that may be implemented as acommon layer or pixel specific layer that is transparent, a groundplane, a metal layer, a power conductive layer, and/or as another typeof material or configuration of materials.

The embedded light sources 104 are formed as individual emitters on thedriver pad array in the emitter material layer, and the embedded lightsources can be individually controlled at the driver pad array. Theemitter material layer 110 can include a reflective structure 114, suchas formed in a reflective array that is embedded or etched, for LEDpixel isolation and reflective collection of photons (e.g., pseudoparabolic collection) towards an ideal light exit plane. The emittermaterial layer includes the reflective structure 114 to reflect thelight to exit the individual direct emitters. Alternatively or inaddition to the reflective structure 114, the imaging structure 102 caninclude other techniques, such as pyramid and/or cylindrical structures,to improve the optical extraction of the light. Implementations of colorconversion may also be applied to the surfaces of the reflective,pyramid, and/or cylindrical structures.

The conductive material layer 112 can be formed with a rough surface 116that is designed to allow more light emission out from the emittermaterial layer rather than be reflected or dispersed. Additionally, thematerial used to form the conductive material layer 112 can be formedaround the sides of the individual LED zones. In embodiments, a p-njunction 118 is formed between the emitter material layer 110 and theconductive material layer, where one of the emitter material layer orthe conductive material layer is a p-type semiconductor and the other isan n-type semiconductor. The conductive material layer 112 can beimplemented as a transparent, common ground plane at the top of theimaging structure for electron flow through the p-n junction 118 as atransparent conductor. Alternatively, two separate layers with aninsulation layer can be implemented to allow reflection on a lower layerwith no connectivity, and allow reflection on an upper layer withconnectivity.

In the imaging structure 102, multiple points between the p-type and then-type semiconductor materials can be connected (e.g., strapped) foroverall efficiency and to improve conductance. The imaging structure isunique for LEDs in that light is not emitted over the whole surface ofthe imaging structure. For micro-lens efficiency, point source emissioncan be implemented, and the emitting area can be well under 50% (e.g.,such as 10%). Accordingly, the conductive material layer 112 may not beimplemented as transparent conductor material, but rather as metalaround the emitting area to strap down the p-type material to ground.Alternatively or in addition, TSV-like channels can be utilized to thetop of the p-type material for either a pixel driver or for ground. Whenthe structures are implemented as diodes, and depending on which way thep-n junction is layered and how the ground and active are wired, variousconfigurations can be implemented.

In embodiments, the imaging structure 102 can be implemented asinorganic LEDs (iLEDs) on the silicon backplane layer 106 to driveline-scanned or pico-projection devices without using an additional LCOSimager. The imaging structure is also implemented for per-pixel colorillumination (rather than full-display) for illumination efficiency andminimal light loss. The imaging structure 102 can be implemented withred, green, and/or blue (RGB) embedded light sources, such as lasers orLEDs, in various one-dimensional (1D), two-dimensional (2D), orn-dimensional arrays, structures, and configurations.

For example, a 1D array imaging structure 120 is formed with red 122,green 124, and blue 126 embedded light sources (e.g., iLEDs or lasers)that are formed with different materials for each different color. Inanother example, a 2D array imaging structure 128 is formed with twoeach RGB embedded light sources, and as indicated, may includeadditional embedded light sources along an X and/or Y axis of the 2Darray. In implementations, a 2D array of embedded light sources caninclude a blue array from blue LED material, a red array from red LEDmaterial, and a green array from green LED material. In otherembodiments, the imaging structure 102 can be formed as base structurewith one material in a single color, such as blue, and then a colorconversion layer can be utilized over the imaging structure to convertgreen and red from the blue base.

The silicon backplane layer 106 of the imaging structure 102 receivesserial or parallel data which is used to drive associated pixels, suchas for example, at speeds of 30 Hz to 60 Hz, or at faster frame rates.In alternate configurations, the imaging structure 102 may beimplemented without the silicon backplane layer 106, in which case theembedded light sources can be initiate passively with data and selectlines, such as driver by line driver chips (similar to those used indisplay devices, for example). In a 1D configuration (e.g., the 1D arrayimaging structure 120), an image is generated over time by driving aline of pixels an x-number of times per frame. Alternatively, sets oflines can be driven to generate a frame of an image, or entire frames ofthe image, at one time. Any of the various arrays and configurations canbe selected based on intended light levels, timing to scan lines, andillumination efficiency.

Each of the embedded light sources can be individually controlled by thedriver pad array 108 (also referred to as the control plane), and can beilluminated in a variety of patterns based on analog, currentmodulation, pulse-width modulation (PWM), and/or based on specific timeand power parameters. The iLED or laser arrays then generate eithermultiple colors (1D×RGB or 2D×RGB) or single color (UV or blue) withadditional color conversion layers, which may include a layer of QuantumDots (QDs). An additional, optional layer or set of layers can beimplemented to leverage LC (liquid crystal) materials to direct,redirect, and/or focus the light that is emitted from the imagingstructure array. In embodiments, the embedded light sources areimplemented as lasers with a surface emitting laser array or a VCSEL(vertical-cavity surface-emitting laser). An example implementation mayinclude LED material in the center of multiple Bragg reflective layersat one-quarter wavelength apart, and the LEDs create the initial photonsthat lase in a chamber formed by the Bragg layers.

The driver pad array 108 is implemented for current-based modulation(rather than a voltage-based LCOS) to drive the individual embeddedlight sources, such as iLEDs or lasers (rather than previously utilizedLC material). The driver pad array 108 can have exposed metal pads todirectly drive the LED array electrically (e.g., a current-based LEDdrive) and optically (e.g., an exposed metal pad utilized as areflector). The connections from the driver pad array 108 to the emittermaterial layer 110 can be implemented by various techniques, such as TSV(through-silicon via), as deposited material, or layered 1D or 2D iLEDstructures on top of the control plane (e.g., the driver pad array 108),where the pixels are the rows or grids of the iLEDs. These connectionsallow control of voltage and/or current for controlling lightillumination from the imaging structure array.

An example imaging structure 130 can be implemented as a fault tolerantarray used to avoid yield loss of illumination when single pixel zonesfail. The imaging structure 130 is formed as an array of nine embeddedlight sources (e.g., iLEDs) in three sections, with three red 132, threegreen 134, and three blue 136 embedded light sources. After production,a test can be used to determine weak or faulty light source sectors,which can then be marked for non-use in a final LED scan controller.Additionally, if one embedded light source of a section fails, theillumination intensity of the other two embedded light sources in thesection can be increased, such as with gamma correction for non-linearillumination, to calibrate for the failed light source.

Other imaging structure configurations can also be utilized as a faulttolerant array, such as with two pixels per sub-pixel (e.g., an array ofsix embedded light sources with two red, two green, and two blueembedded light sources), or an array of embedded light sources with morethan three pixels per color. Other imaging structure configurations canbe implemented with multiple sets of LED arrays that are positioned, orotherwise fit, extremely close to one another to avoid having multipleLEDs per pixel. Any number of configuration patterns are also possible,such as a 2D array, four square blocks, a 2×4 configuration, or anyother n×m configuration that allows for smaller array yields.

FIG. 2 illustrates examples 200 of the imaging structures described withreference to FIG. 1, and implemented with a micro lens optic thatcollects and redirects the light emitted from the embedded lightsources. In an example 202, the imaging structure 120, which is anexample of the imaging structure 102, has micro lens optics 204positioned over the embedded light sources, such as shown at 206. Forexample, the micro lens optics are positioned above the LED emittersand/or the conductive material layer 112 to reduce light loss.Optionally, a DBEF (dual brightness enhancement film) material can beutilized between the imaging structure and the micro lens optics toextract polarized light. The light 208 that is emitted from the RGBlight sources (e.g., iLEDs or lasers) is reflected through the microlens optics and can then be directed in an imaging system, such asreflected off of a MEMS mirror and then directed into a waveguide orotherwise projected. In embodiments, the micro lens optics 204 may beformed as parabolic optics as shown at 210 for more efficientredirection (e.g., focus or concentration) of the light 208 that isemitted from the embedded light sources.

In embodiments, the walls of the LED emitters that are formed as theembedded light sources in an imaging structure, such as the imagingstructure 120, can be formed to approximate parabolic reflection in theemitter material layer 110 to direct reflected light from within theemitter material. For example, as shown at 212, an individual LED 214can be formed in the emitter material layer with the walls of the LEDemitter designed to approximate a parabolic structure 216 to direct asmuch of the reflected light 218 as possible back to the micro lens optic204. Alternatively, the parabolic reflector material may be formed atthe top of the LED material (e.g., the emitter material layer 110) ifthe p-n junction is also in the top section of the LED material. Anymethod allowing implantation of a reflective and/or conductive materialbelow the p-n junction would have far higher efficiencies. The pseudoparabolic collectors can be formed using the driver metal as a bottom,etched, pressed, or other techniques with metal or other reflectivematerial in the side walls of the LED material. These structures areformed deeper than the p-n material junction, but do not have to runcompletely through the LED material.

FIG. 3 illustrates an example system 300 in which various embodiments ofan imaging structure with embedded light sources can be implemented. Anexample wearable display device 302 includes left and right display lenssystems, such as display lens systems 304 that are viewed from aperspective 306 of the wearable display device, as if viewing thedisplay lens systems from the top of the device. In embodiments, thedisplay lens systems 304 can be implemented as left and right displaylens systems of the wearable display device described with reference toFIG. 4. A wearable display device can be implemented as any type ofglasses or head-mounted display (HMD) that includes implementations ofthe display lens systems 304 (e.g., left and right display lens systems)through which a user can view the surrounding environment, yet also seevirtual images that are generated for display and appear as a part ofthe environment. References to a left imaging system and a right imagingsystem, as described herein, correlate to a user's left and right eyes(e.g., from the perspective of wearing and looking through the wearabledisplay device). Alternatively, the left and right imaging systems maybe described from the perspective of looking at the wearable displaydevice.

The display lens systems 304 include a display optic 308, such as asee-through and reflecting waveguide, through which light 310 of animage (e.g., an image of the environment as viewed through the wearabledisplay device) is projected for viewing. In this example, the displaylens systems 304 also include an imaging unit 312, which can beimplemented with any number of micro display panels, imaging structureswith direct emitters, lenses, and reflecting elements to display andproject a virtual image into a see-through and reflecting waveguide. Thesee-through, reflecting waveguide (i.e., the display optic 308) isimplemented for internal reflection and conducts visible light of avirtual image that is generated by the imaging unit 312 for viewing by auser, and also passes through the light 310 from the surroundingenvironment for viewing by the user. A display lens system 304 with animaging unit can also be implemented with components of the display lenssystem described with reference to FIG. 4 to implement embodiments of animaging structure with embedded light sources.

In embodiments, the imaging units 312 of the display lens systems 304each include a printed circuit board 314 that incorporates an embodimentof an imaging structure 316. The imaging structures 316 can beimplemented as any of the example imaging structures described withreference to FIGS. 1-3, such as the imaging structure 120 with RGBembedded light sources or the imaging structure 120 with the micro lensoptics 204 positioned over the embedded light sources, such as shown at206.

An imaging structure 316 includes the embedded light sources that emitlight, which is reflected by a reflecting mirror 318 onto a MEMSscanning mirror 320 that is also incorporated with the printed circuitboard 314. The imaged light is then directed by the scanning mirrorthrough an imaging optic 322 that directs the light into thesee-through, reflecting waveguide (i.e., the display optic 308). TheMEMS scanning mirror (e.g., or other electrically alterable mirror), oran LC steering solution, can be implemented with line scanningtechniques or full X,Y LED array light source configurations, which canbe used to avoid long and/or narrow arrays of LED material, allow largerresolutions, and can be used with eye-tracking projection solutions.

FIG. 4 illustrates an example system 400 that includes an examplewearable display device 402 in which embodiments of an imaging structurewith embedded light sources can be implemented. The wearable displaydevice can be implemented as any type of glasses or head-mounted display(HMD) that includes display lens systems 404 (e.g., left and rightdisplay lens systems) through which a user can view the surroundingenvironment, yet also see virtual images (e.g., any type of object,video, text, graphic, and the like) that are generated for display andappear as a part of the environment.

The wearable display device 402 can be implemented as an independent,portable system that includes memory, software, a processor, and/or apower source. Alternatively or in addition, the wearable display devicemay be communicatively linked to a controller 406 that includes any oneor combination of the memory, software, processor, and/or power source,such as a battery unit. The controller can be implemented for wired orwireless communication with the wearable display device. The controllerand/or the wearable display device can also be implemented with anynumber and combination of differing components as further described withreference to the example device shown in FIG. 6. For example, thecontroller and/or the wearable display device includes an imagingapplication implemented as computer-executable instructions, such as asoftware application, and executed by a processor to implementembodiments of an imaging structure with embedded light sources asdescribed herein.

In embodiments, the controller may be implemented as a dedicated device(e.g., the wired controller 406), as a mobile phone 408, a tablet orother portable computer device, a gaming system 410, or as any othertype of electronic device that can be implemented to process andgenerate virtual images for display as part of the environment that isviewed through the display lens system of the wearable display device.The controller may communicate with the wearable display devicewirelessly via WiFi™, Bluetooth™, infrared (IR), RFID transmission,wireless Universal Serial Bus (WUSB), cellular, or via other wirelesscommunication techniques.

The example system 400 also includes a data server 412, or data service,that communicates, or otherwise distributes, virtual image data 414 tothe wearable display device 402 via a communication network 416. Forexample, the data server may be part of a network-based gaming systemthat generates virtual images for augmented reality display at thewearable display device. Alternatively, the data server may be part of anavigation system that communicates navigation directions andinformation for display in the display lens systems 404 of the wearabledisplay device. In another example, the data server may be part of amessaging service, such as an e-mail or text messaging system, thatcommunicates e-mail and/or text messages to the wearable display devicefor display in the display lens systems, where a user can read a messageas an augmented reality image that is displayed over the environmentviewed through the wearable display device.

Any of the devices, servers, and/or services can communicate via thecommunication network 416, which may be implemented to include wiredand/or wireless networks. The communication network can also beimplemented using any type of network topology and/or communicationprotocol, and can be represented or otherwise implemented as acombination of two or more networks, to include IP-based networks and/orthe Internet. The communication network may also include mobile operatornetworks that are managed by mobile operators, such as a communicationservice provider, cell-phone provider, and/or Internet service provider.

The wearable display device 402 includes a frame 418, such as in theform of glasses, goggles, or any other structure, that supports andincorporates the various components of the device, as well as serves asa conduit for electrical and other component connections. A componentsmodule 420 (or components modules on the left, right, and/or both sidesof the device frame) incorporates any of the various components, such asprocessing and control circuitry, memory, software, a processor, GPStransceiver, and/or power source. The wearable display device may alsoinclude a microphone 422 to record audio data from the surroundingenvironment, as well as ear phones for audio feedback as part of anaugmented reality experience.

The wearable display device 402 also includes various cameras 424 thatcapture video and still images of the surrounding environment. The imageand video data can be processed on the device and/or by a controllerdevice (e.g., controller 406), and used to create a mapping field toorient and track a user in the environment space. The wearable displaydevice can also include eye tracking cameras used to determine a user'seyeball location and track eye movements. The wearable display devicemay also include a temperature sensor, as well as inertial sensorsand/or attitude sensors, including MEMS gyros, magnetic sensors (e.g., acompass), and acceleration sensors for sensing position, orientation,and acceleration of the wearable display device.

An example of one display lens system 404 is shown from a viewerperspective 426 of the wearable display device 402, as if viewing thedisplay lens system from the top of the device. The display lens systemincludes an imaging system 428, which can be implemented with any numberof micro display panels, lenses, and reflecting elements to display andproject a virtual image into a see-through and reflecting waveguide 430.A display lens system 404 can also be implemented as the imaging unitsdescribed with reference to FIG. 3 to implement embodiments of animaging structure with embedded light sources. The see-through,reflecting waveguide 430 is implemented for internal reflection andconducts the visible light 432 of a virtual image that is generated bythe imaging unit for viewing by a user, and also passes through thelight 434 from the surrounding environment for viewing by the user.

The micro display panels, lenses, and/or reflecting elements of theimaging system 428 can be implemented with various display technologies,such as implemented with a transparent LCD, or using a transmissiveprojection technology where the light source is modulated by opticallyactive material, backlit with white light. These technologies can beimplemented using LCD type displays with powerful backlights and highoptical energy densities. Alternatively, a micro display and/orreflecting element can be implemented using a reflective technology,such as digital light processing (DLP) and liquid crystal on silicon(LCOS), that reflects external light, which is reflected and modulatedby an optical material.

In embodiments, the imaging system 428 (or other components of a displaylens system 404) can be implemented to include an infra-red (IR) laserutilized for system calibrations and/or as an illumination source for aneye-tracking system and camera that tracks the position of a user'seyes. The eye-tracking system includes the eye-tracking illuminationsource, which is not a visible light, and includes an eye-tracking IRsensor. In implementations that include color conversion, theillumination source can be implemented as UV or blue iLED arrays thatemit the IR light, which may be emitted from one or more of the pixels.The IR sensor can be implemented as an IR camera that provides infraredimage data of the eye for eye-tracking processing, or an IR sensor thatdetects eye reflections when the eye is illuminated. Alternatively or inaddition, sensors can be implemented in the CMOS driver array to detectthe feedback. In implementations, the light reflections (e.g., the IRreturn) may be directed with SBG or SRB methods. The see-through andreflecting waveguide 430 can also be utilized for the infraredillumination, and for eyeball reflections that the eye-tracking systemuses to track the position of the user's eyes.

In this example, the display lens systems 404 include an optionalopacity filter 436, and a see-through lens 438 on each side of thewaveguide 430. The see-through lenses can be standard eye-glass lensesand made to prescription (or no prescription). The opacity filterselectively blocks natural light, either uniformly or on a per-pixelbasis, from passing through the see-through and reflecting waveguide toenhance the contrast of a displayed virtual image.

Example method 500 is described with reference to FIG. 5 in accordancewith one or more embodiments of an imaging structure with embedded lightsources. Generally, any of the services, functions, methods, procedures,components, and modules described herein can be implemented usingsoftware, firmware, hardware (e.g., fixed logic circuitry), manualprocessing, or any combination thereof. A software implementationrepresents program code that performs specified tasks when executed by acomputer processor. The example methods may be described in the generalcontext of computer-executable instructions, which can include software,applications, routines, programs, objects, components, data structures,procedures, modules, functions, and the like. The program code can bestored in one or more computer-readable storage media devices, bothlocal and/or remote to a computer processor. The methods may also bepracticed in a distributed computing environment by multiple computerdevices. Further, the features described herein are platform-independentand can be implemented on a variety of computing platforms having avariety of processors.

FIG. 5 illustrates example method(s) 500 of an imaging structure withembedded light sources. The order in which the method blocks aredescribed are not intended to be construed as a limitation, and anynumber of the described method blocks can be combined in any order toimplement a method, or an alternate method.

At block 502, a silicon backplane is formed with a driver pad array thatindividually controls embedded light sources. For example, the imagingstructure 102 (FIG. 1) is formed with the silicon backplane layer 106and the driver pad array 108, via which the embedded light sources canbe individually controlled.

At block 504, the embedded light sources are formed as direct emitterson the driver pad array in an emitter material layer. For example, theimaging structure 102 includes the emitter material layer 110 (e.g.,inorganic material) in which the embedded light sources are formed aslasers or LEDs for direct light emission. The embedded light sources canbe formed as individual emitters in the emitter material layer toapproximate parabolic reflection that directs reflected light fromwithin an individual direct emitter. The emitter material layer can alsoinclude the reflective structure 114 that reflects the light to exit theembedded light sources. In embodiments, the embedded light sourcesinclude red, green, and blue (RGB) direct emitters that form the imagingstructure as one a one-dimensional or two-dimensional array of theembedded light sources.

At block 506, a conductive material layer is formed over the embeddedlight sources and, at block 508, a p-n junction is formed between theemitter material layer and the conductive material layer. For example,the imaging structure 102 includes the conductive material layer 112 andthe p-n junction 118 is formed between the emitter material layer 110and the conductive material layer, where one of the emitter materiallayer or the conductive material layer is a p-type semiconductor and theother is an n-type semiconductor.

At block 510, the light that is emitted from the embedded light sourcesis directed with micro lens optics that are positioned over theconductive material layer. For example, an imaging structure, such asthe imaging structure 120, includes the micro lens optics 204 (FIG. 2)that directs the light that is emitted from the embedded light sources.In an embodiment, the micro lens optics are parabolic optics as shown at210 that concentrates the light that is emitted from the embedded lightsources. At block 412, individual embedded light sources are controlledwith current modulation. For example, an imaging application 620 (FIG.6) initiates current-modulation control of the embedded light sourcesvia the driver pad array 108.

FIG. 6 illustrates various components of an example device 600 that canbe implemented as any of the devices described with reference to theprevious FIGS. 1-5, such as a wearable display device and/or acontroller for a wearable display device. In embodiments, the device maybe implemented as any one or combination of a fixed or mobile device, inany form of a consumer, computer, portable, communication, phone,navigation, appliance, gaming, media playback, and/or electronic device.The device may also be associated with a user (i.e., a person) and/or anentity that operates the device such that a device describes logicaldevices that include users, software, firmware, hardware, and/or acombination of devices.

The device 600 includes communication devices 602 that enable wiredand/or wireless communication of device data 604, such as virtual imagedata, as well as video and images data, and other media content storedon the device. The media content stored on the device can include anytype of audio, video, and/or image data. The device includes one or moredata inputs 606 via which any type of data, media content, and/or inputscan be received, such as user-selectable inputs and any other type ofaudio, video, and/or image data received from any content and/or datasource.

The device 600 also includes communication interfaces 608, such as anyone or more of a serial, parallel, network, or wireless interface. Thecommunication interfaces provide a connection and/or communication linksbetween the device and a communication network by which otherelectronic, computing, and communication devices communicate data withthe device.

The device 600 includes one or more processors 610 (e.g., any ofmicroprocessors, controllers, and the like) or a processor and memorysystem (e.g., implemented in an SoC), which process computer-executableinstructions to control the operation of the device. Alternatively or inaddition, the device can be implemented with any one or combination ofsoftware, hardware, firmware, or fixed logic circuitry that isimplemented in connection with processing and control circuits which aregenerally identified at 612. Although not shown, the device can includea system bus or data transfer system that couples the various componentswithin the device. A system bus can include any one or combination ofdifferent bus structures, such as a memory bus or memory controller, aperipheral bus, a universal serial bus, and/or a processor or local busthat utilizes any of a variety of bus architectures.

The device 600 also includes one or more memory devices 614 (e.g.,computer-readable storage media) that enable data storage, such asrandom access memory (RAM), non-volatile memory (e.g., read-only memory(ROM), flash memory, etc.), and a disk storage device. A disk storagedevice may be implemented as any type of magnetic or optical storagedevice, such as a hard disk drive, a recordable and/or rewriteable disc,and the like. The device may also include a mass storage media device.Computer-readable storage media can be any available medium or mediathat is accessed by a computing device.

A memory device 614 provides data storage mechanisms to store the devicedata 604, other types of information and/or data, and deviceapplications 616. For example, an operating system 618 can be maintainedas a software application with the memory device and executed on theprocessors. The device applications may also include a device manager orcontroller, such as any form of a control application, softwareapplication, signal processing and control module, code that is nativeto a particular device, a hardware abstraction layer for a particulardevice, and so on. In this example, the device applications also includean imaging application 620 that may implement embodiments of an imagingstructure with embedded light sources as described herein.

The device 600 may also include an audio and/or video processing system622 that generates audio data for an audio system 624 and/or generatesdisplay data for a display system 626. In implementations, the audiosystem and/or the display system are external components to the device.Alternatively, the audio system and/or the display system are integratedcomponents of the example device.

Although embodiments of an imaging structure with embedded light sourceshave been described in language specific to features and/or methods, theappended claims are not necessarily limited to the specific features ormethods described. Rather, the specific features and methods aredisclosed as example implementations of an imaging structure withembedded light sources.

1. An imaging structure, comprising: a silicon backplane with a driverpad array; embedded light sources formed on the driver pad array in anemitter material layer having a same length and width as the siliconbackplane with the driver pad array; and a conductive material layerover the embedded light sources forms a p-n junction between the emittermaterial layer and the conductive material layer, the conductivematerial layer having the same length and width as the silicon backplanewith the driver pad array and the emitter material layer.
 2. An imagingstructure as recited in claim 1, wherein the embedded light sources areconfigured for individual control at the driver pad array to generateand emit light.
 3. An imaging structure as recited in claim 1, whereinthe embedded light sources are formed in inorganic material as one oflasers or LEDs for direct light emission.
 4. An imaging structure asrecited in claim 3, wherein the LEDs are individual emitters formed inthe emitter material layer and the LEDs approximate parabolic reflectionthat directs reflected light from within the inorganic material.
 5. Animaging structure as recited in claim 1, wherein the embedded lightsources are individual emitters formed in the emitter material layer andconfigured for individual current-based control.
 6. An imaging structureas recited in claim 5, wherein the conductive material layer is formedaround the individual emitters.
 7. An imaging structure as recited inclaim 1, wherein the embedded light sources are emitter cells formed inthe emitter material layer, and wherein the emitter material layerincludes a reflective structure configured to reflect the light to exitthe emitter cells.
 8. An imaging structure as recited in claim 1,wherein the embedded light sources comprise red, green, and blue (RGB)direct emitters that form the imaging structure as one of aone-dimensional array or a two-dimensional array of the embedded lightsources.
 9. An imaging structure as recited in claim 1, wherein theimaging structure is a fault-tolerant array of sections of the embeddedlight sources, and wherein a section of the fault-tolerant arrayincludes redundant embedded light sources configured for increasedillumination in an event that one of the redundant embedded lightsources fails.
 10. An imaging structure as recited in claim 1, furthercomprising micro lens optics positioned over the conductive materiallayer and configured to direct the light that is emitted from theembedded light sources.
 11. An imaging structure as recited in claim 10,wherein the micro lens optics are formed as parabolic optics configuredto concentrate the light that is emitted from the embedded lightsources.
 12. A method, comprising: forming a silicon backplane with adriver pad array that individually controls embedded light sources;forming the embedded light sources as direct emitters on the driver padarray in an emitter material layer having a same length and width as thesilicon backplane with the driver pad array; and forming a conductivematerial layer over the embedded light sources, the conductive materiallayer having the same length and width as the silicon backplane with thedriver pad array and the emitter material layer.
 13. A method as recitedin claim 12, wherein the embedded light sources are formed as individualemitters in the emitter material layer to approximate parabolicreflection that directs reflected light from within an individualemitter, and the method further comprising directing light emitted fromthe embedded light sources with micro lens optics that are positionedover the conductive material layer.
 14. A method as recited in claim 13,wherein the micro lens optics are parabolic optics that concentrate thelight that is emitted from the embedded light sources.
 15. A method asrecited in claim 12, further comprising controlling individual embeddedlight sources with current modulation.
 16. A method as recited in claim12, further comprising forming a p-n junction between the emittermaterial layer and the conductive material layer.
 17. A method asrecited in claim 12, wherein the embedded light sources are formed ininorganic material as one of lasers or LEDs for direct light emission.18. A method as recited in claim 12, wherein the emitter material layerincludes a reflective structure that reflects the light to exit theembedded light sources.
 19. A method as recited in claim 12, wherein theembedded light sources comprise red, green, and blue (RGB) directemitters that form an imaging structure as one of a one-dimensionalarray or a two-dimensional array of the embedded light sources.
 20. Awearable display device, comprising: left and right imaging units ofdisplay lens systems configured to generate an augmented reality image,each of the left and right imaging units including an imaging structurethat comprises: a silicon backplane with a driver pad array configuredto individually control embedded light sources that are formed as directemitters on the driver pad array in sections of an emitter materiallayer; and a conductive material layer over the embedded light sources,the conductive material layer forming a p-n junction between the emittermaterial layer and the conductive material layer, the conductivematerial layer having a same length and width as the silicon backplane,the driver pad array, and the emitter material layer.